Wafer level chip packaging
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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May 3, 2011
Grant Date -
Aug 16, 2007
app pub date -
Jan 19, 2007
filing date -
Jan 23, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
Packaged microelectronic elements are provided. In an exemplary embodiment, a microelectronic element having a front face and a plurality of peripheral edges bounding the front face has a device region at the front face and a contact region with a plurality of exposed contacts adjacent to at least one of the peripheral edges. The packaged element may include a plurality of support walls overlying the front face of the microelectronic element such that a lid can be mounted to the support walls above the microelectronic element. For example, the lid may have an inner surface confronting the front face. In a particular embodiment, some of the contacts can be exposed beyond edges of the lid.
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