Multiple layer strain gauge
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United States of America Patent
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May 10, 2011
Grant Date -
Sep 23, 2010
app pub date -
Mar 20, 2009
filing date -
Mar 20, 2009
priority date (Note) -
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Abstract
An apparatus and method uses a die having at least one perimeter side with multiple pads. A structure is positioned between the at least one perimeter side and the multiple pads having multiple layers within the die. The structure functions as both a strain gauge and a crack stop. The structure arrests cracks from propagating from the at least one perimeter side to an interior of the die and provides an electrical resistance value as a function of an amount of strain existing where the structure is positioned. In another form the structure is implemented on a substrate such as a printed circuit board rather than in a semiconductor die.
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