Method to provide a layer with uniform etch characteristics
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United States of America Patent
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May 10, 2011
Grant Date -
Feb 16, 2006
app pub date -
Aug 16, 2004
filing date -
Aug 16, 2004
priority date (Note) -
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Abstract
The present invention includes a method and a composition to form a layer on a substrate having uniform etch characteristics. To that end, the method includes controlling variations in the characteristics of a solid layer, such etch characteristics over the area of the solid layer as a function of the relative rates of evaporation of the liquid components that comprise the composition from which the solid layer is formed.
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