Light emitting diode for harsh environments
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United States of America Patent
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May 10, 2011
Grant Date -
Sep 11, 2008
app pub date -
Mar 6, 2008
filing date -
Mar 8, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A light emitting diode for harsh environments includes a substantially transparent substrate, a semiconductor layer deposited on a bottom surface of the substrate, several bonding pads, coupled to the semiconductor layer, formed on the bottom surface of the substrate, and a micro post, formed on each bonding pad, for electrically connecting the light emitting diode to a printed circuit board. An underfill layer may be provided between the bottom surface of the substrate and the top surface of the printed circuit board, to reduce water infiltration under the light emitting diode substrate. Additionally, a diffuser may be mounted to a top surface of the light emitting diode substrate to diffuse the light emitted through the top surface.
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