Chip packages with covers
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United States of America Patent
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May 10, 2011
Grant Date -
Feb 22, 2007
app pub date -
Oct 26, 2006
filing date -
Dec 10, 1999
priority date (Note) -
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Abstract
This invention discloses a crystalline substrate based device including a crystalline substrate having formed thereon a microstructure; and at least one packaging layer which is sealed over the microstructure by means of an adhesive and defines therewith at least one gap between the crystalline substrate and the at least one packaging layer. A method of producing a crystalline substrate based device is also disclosed.
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