Microelectronic packages and methods therefor
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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May 10, 2011
Grant Date -
Nov 9, 2006
app pub date -
Dec 22, 2005
filing date -
Mar 16, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An assembly for testing microelectronic devices includes a microelectronic element having faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, at least some of the conductive posts being electrically interconnected with the microelectronic element. The assembly also includes a plurality of support elements disposed between the microelectronic element and the substrate for supporting the flexible substrate over the microelectronic element. At least some of the conductive posts are offset from the support elements.
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