Leadless semiconductor package and method of manufacture
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United States of America Patent
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May 17, 2011
Grant Date -
Jun 7, 2007
app pub date -
Oct 31, 2006
filing date -
Dec 2, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
A package to encase a semiconductor package is manufactured by the following steps. First, an electrically conductive frame is provided. This frame has a plurality of leadframes arranged in a matrix with each leadframe having a plurality of spaced leads extending outwardly from a central aperture. The electrically conductive frame further includes a plurality of connecting bars joining outer end portions of adjacent ones of the leadframes. Second, a groove is formed in the connecting bars to form a reduced thickness portion between the outer end portions of adjacent ones of the leadframes. Third, a semiconductor device is electrically coupled to inner portions of said leads. Fourth, the frame and the semiconductor devices are encapsulated in a molding compound. Finally, the molding compound and the frame are cut along the grooves to form singulated semiconductor packages having outer lead portions with a height greater than the height of the reduced thickness portion.
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