Method of operating an electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes
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United States of America Patent
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May 24, 2011
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N/A
app pub date -
Aug 10, 2007
filing date -
Mar 19, 2004
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Abstract
A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes.
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