Three-dimensional miniaturized power supply
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United States of America Patent
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May 24, 2011
Grant Date -
Aug 19, 2010
app pub date -
Dec 21, 2007
filing date -
Dec 3, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A three-dimensional miniaturized power supply is composed of at least two of a first circuit board and a second circuit board which are assembled in a chamber of a container in a three-dimensional spatial form, wherein an insulation spacing, which is in compliance with an ITE safety regulation, is provided between a circuit of the first circuit board and a circuit of the second circuit board, allowing an area and a volume of the power supply to be miniaturized, such that the power supply can be emplaced in a small container.
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