Methods for fabricating semiconductor components with conductive interconnects having planar surfaces
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United States of America Patent
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May 31, 2011
Grant Date -
Jun 10, 2010
app pub date -
Feb 10, 2010
filing date -
May 19, 2005
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Abstract
A backside method for fabricating a semiconductor component with a conductive interconnect includes the step of providing a semiconductor substrate having a circuit side, a backside, and a substrate contact on the circuit side. The method also includes the steps of forming a substrate opening from the backside to the substrate contact, and then bonding the conductive interconnect to an inner surface of the substrate contact.
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