Bail release mechanism for communications module
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United States of America Patent
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Jun 7, 2011
Grant Date -
Jun 10, 2010
app pub date -
Jun 4, 2009
filing date -
Jun 5, 2008
priority date (Note) -
In Force
status (Latency Note)
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Abstract
In one example, a bail release mechanism includes a bail and a de-latching member. The bail is configured to be attached to the shell of a module that includes a latch pin configured to engage a structure of a host device receptacle to secure the module within the receptacle. The bail is further configured to rotate about a first axis between a latched position and an unlatched position. The first axis is in a fixed position relative to the shell. The de-latching member is attached to the bail at a second axis that is offset from the first axis and is configured to rotate about the second axis. The second axis is movable relative to the shell. The de-latching member includes a first end configured to displace the structure of the receptacle during rotation of the de-latching member to disengage the latch pin from the structure.
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