Method for applying selectively a layer to a structured substrate by the usage of a temperature gradient in the substrate

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United States of America Patent

PATENT NO 7955645
APP PUB NO 20090239371A1
SERIAL NO

11791549

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Abstract

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A semiconductor wafer (10) is structured such that fine structures (3), such as membranes, bridges or tongues, with a thickness d<

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Patent Owner(s)

Patent OwnerAddress
SENSIRION AGLAUBISRÜTISTRASSE 50 STÄFA 8712

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kleinlogel, Christoph Zurich, CH 5 24
Mayer, Felix Stäfa, CH 68 1199

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