Ultrasonic bonding of dissimilar materials
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United States of America Patent
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Jun 7, 2011
Grant Date -
Jun 23, 2005
app pub date -
Dec 22, 2003
filing date -
Dec 22, 2003
priority date (Note) -
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Abstract
Ultrasonically bonded laminated absorbent products comprising a first substrate, a second substrate, and an adhesive composition are disclosed. The first and second substrates are dissimilar or non-bondable materials. The adhesive composition comprises a mixture of atactic and isotactic polymers such that it has melt and flow characteristics similar to those of the materials.
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