US Patent No: 7,956,357
Number of patents in Portfolio can not be more than 2000
Test pads coupled with leads unconnected with die pads
Stats
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Jun 7, 2011
Issued date -
Jun 30, 2009
filing date -
12/495,060
serial no -
In Force
status
Importance
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Abstract
Timely testing of die on wafer reduces the cost to manufacture ICs. This disclosure describes a die test structure and process to reduce test time by adding test pads on the top surface of the die. The added test pads allow a tester to probe and test more circuits within the die simultaneously. Also, the added test pads contribute to a reduction in the amount of test wiring overhead traditionally required to access and test circuits within a die, thus reducing die size.
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First Claim
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
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| 5,506,499 Multiple probing of an auxilary test pad which allows for reliable bonding to a primary bonding pad | 125 | 1995 | |
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| 7,399,990 Wafer-level package having test terminal | 3 | 2006 | |
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| 6,180,426 High performance sub-system design and assembly | 63 | 1999 | |
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| 6,097,098 Die interconnections using intermediate connection elements secured to the die face | 58 | 1997 | |
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| 6,535,999 Test and observe mode for embedded memory | 7 | 1999 | |
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| 7,569,853 Test pads on leads unconnected with die pads | 2 | 2008 | |
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Dec 7, 2014 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Dec 7, 2018 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Dec 7, 2022 |
| Fee | Large entity fee | small entity fee | micro entity fee |
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