Through-wafer interconnects for photoimager and memory wafers
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United States of America Patent
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Jun 7, 2011
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app pub date -
Mar 17, 2010
filing date -
Sep 2, 2004
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Abstract
A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.
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