Electrical connection of a substrate within a vacuum device via electrically conductive epoxy/paste
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United States of America Patent
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Jun 7, 2011
Grant Date -
Jan 14, 2010
app pub date -
Jul 10, 2008
filing date -
Jul 10, 2008
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An image intensifier includes a microchannel plate (MCP) having an output surface, and a ceramic substrate having an outer surface. The output surface of the MCP and the outer surface of the ceramic substrate are oriented facing each other. An imager is substantially buried within the ceramic substrate, and an input surface of the imager is exposed to receive electrons from the output surface of the MCP. The input surface of the imager and the outer surface of the ceramic substrate are oriented in substantially the same plane. The input surface of the imager and the outer surface of the ceramic substrate are disposed at a very close distance from the output surface of the MCP. The imager includes input/output pads, and the ceramic substrate includes input/output pads. A conductive epoxy connects a respective input/output pad of the imager to a respective input/output pad of the ceramic substrate.
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