Phase change material containing fusible particles as thermally conductive filler
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United States of America Patent
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Jun 14, 2011
Grant Date -
Dec 13, 2007
app pub date -
Aug 15, 2007
filing date -
Feb 8, 2002
priority date (Note) -
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Abstract
An electronic assembly having a microelectronic die, a heat spreader and a heat sink. A first thermal interface material is disposed between the microelectronic die and the heat spreader. A second thermal interface material is disposed between the heat spreader and a heat sink. The first and second interface materials each comprising a phase change polymer, a solderable material and a plurality of thermally conductive non-fusible particles. The solderable material interconnecting the non-fusible particles to form a plurality of columnar structures within the phase change polymer.
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