Thermal via heat spreader package and method
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United States of America Patent
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Jun 14, 2011
Grant Date -
N/A
app pub date -
Apr 9, 2009
filing date -
Apr 9, 2009
priority date (Note) -
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Abstract
A thermal via heat spreader package includes an electronic component having an active surface including a nonfunctional region. A package body encloses the electronic component, the package body comprising a principal surface. Thermal vias extend from the principal surface through at least a portion of the package body and towards the nonfunctional region. A heat spreader is thermally connected to the thermal vias. Heat generated by the electronic component is dissipated to the thermal vias and to the heat spreader. The density of the thermal vias is increased in a hotspot of the electronic component thus maximizing heat transfer from the hotspot. In this manner, optimal heat transfer from the electronic component is achieved.
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