Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates
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United States of America Patent
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Jun 14, 2011
Grant Date -
Jan 5, 2006
app pub date -
Aug 31, 2005
filing date -
Sep 19, 2003
priority date (Note) -
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Abstract
A support structure for use with a semiconductor substrate in thinning, or backgrinding, thereof, as well as during post-thinning processing of the semiconductor substrate includes a portion that extends substantially along and around an outer periphery of the semiconductor substrate to impart the thinned semiconductor substrate with rigidity. The support structure may be configured as a ring or as a member that substantially covers an active surface of the semiconductor substrate and forms a protective structure over each semiconductor device carried by the active surface.
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