Integrated circuit, and a mobile phone having the integrated circuit
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United States of America Patent
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Jun 14, 2011
Grant Date -
Nov 29, 2007
app pub date -
Apr 4, 2005
filing date -
Apr 16, 2004
priority date (Note) -
In Force
status (Latency Note)
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Abstract
In an example embodiment, an integrated circuit comprises an on-chip electronic component. The on-chip electronic component has an active surface in a hermetically sealed cavity and a cover to hermetically seal the cavity. There is an additional electronic component wherein the additional electronic component is fixed on the cover.
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