Recycling faulty multi-die packages

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United States of America Patent

PATENT NO 7964445
APP PUB NO 20090263935A1
SERIAL NO

12487524

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Abstract

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The present invention teaches the recycling of a faulty multi-die memory package by isolating the functional part of the package and using it as a smaller memory package.

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Patent Owner(s)

Patent OwnerAddress
SANDISK IL LTD44425 KFAR SABA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Meir, Avraham Rishon Lezion, IL 51 1338

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