Interposer for decoupling integrated circuits on a circuit board
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United States of America Patent
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Jun 21, 2011
Grant Date -
Aug 10, 2006
app pub date -
Dec 14, 2005
filing date -
Feb 4, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
An interposer (20) is used for decoupling a microchip (10) on a circuit board (30). The interposer (20) contains on its upper and lower surfaces structured metal layers (26a-26d) for attachment to the microchip (10) and the circuit board (30), respectively. Inside the interposer, there are two sets of mutually isolated metal structures (21, 22) extending substantially perpendicular to the upper and lower surfaces of said interposer (20). The first set (21) extends closer towards the upper surface than the second set (22), while said second set (22) extends closer towards the lower surface than said first set (21).
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