Expandable interbody fusion device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7967867
SERIAL NO

11756050

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An expandable interbody fusion device includes superior and inferior endplates that are configured to receive a sequentially inserted stack of interlocking expansion members or wafers. The like-configured wafers include features on their top and bottom surfaces that interlock the wafers in multiple degrees of freedom so that the wafer stack is not disrupted when the fusion device is fully expanded. One of the interlocking features includes a plurality of prongs projecting from an upper surface of the wafers and into a recess defined in the lower surface of an adjacent previously inserted like-configured wafer. The prongs and recesses are configured to prevent retrograde movement of each new wafer in a direction opposite the direction of insertion. Other interlocking features prevent movement in the direction of insertion, transverse to the insertion direction and vertically within the stack.

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Patent Owner(s)

Patent OwnerAddress
SPINE WAVE INC3 ENTERPRISE DRIVE SUITE 210 SHELTON CT 06484

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Barreiro, Peter West Haven, US 38 1748
Landry, Michael E Austin, US 103 12411
Ty, Dennis Milford, US 18 869

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