Method for electroplating a substrate
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United States of America Patent
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Jun 28, 2011
Grant Date -
Jun 17, 2010
app pub date -
Feb 10, 2010
filing date -
Jul 29, 2006
priority date (Note) -
Expired
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Abstract
One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.
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