Chip package sealing method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7972901
APP PUB NO 20050189332A1
SERIAL NO

11105635

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of manufacturing a package including manufacturing a substrate to include at least one layer of LCP material, manufacturing a cover made of LCP material to include a lower lip, and sealing the cover to the substrate by heating the interface between the lower lip and the substrate.

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Patent Owner(s)

  • FOSTER-MILLER, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Farrell, Brian Quincy, US 63 1882
Jaynes, Paul Attleboro, US 4 94
Taylor, Malcolm Pepperell, US 19 427

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