Resin composition and resin molded object

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7973102
APP PUB NO 20070093588A1
SERIAL NO

10580336

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A resin composition which reduces hydrolysis thereof and reduces the color change thereof at the time of heating and a resin molded object which reduces hydrolysis thereof and reduces quality change of content therein are provided. The resin composition includes a resin and an organically modified layered silicate in which a substituted silyl group having a substituted or non-substituted alkyl group bonds to a layered silicate. The resin molded object is obtained by molding a resin composition including a resin and an organically modified layered silicate in which a substituted silyl group having a substituted or non-substituted alkyl group bonds to a layered silicate.

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Patent Owner(s)

  • SHISEIDO COMPANY, LTD.;UNITIKA LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Takahashi, Shun Yokohama, JP 21 130
Takata, Motoki Yokohama, JP 21 107

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