Tapered dielectric and conductor structures and applications thereof
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United States of America Patent
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Jul 5, 2011
Grant Date -
Jan 29, 2009
app pub date -
May 29, 2008
filing date -
Nov 12, 2003
priority date (Note) -
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Abstract
Disclosed are tapered dielectric and conductor structures which provide controlled impedance interconnection while signal conductor lines transition from finer pitches to coarser pitches thereby obviating electrical discontinuities generally associated with changes of circuit contact pitch. Also disclosed are methods for the construction of the devices and applications therefore.
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