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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
INTEL CORPORATION	SANTA CLARA CA 95054

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Chan, Michael Y	Sunnyvale, US	12	277
Harmes, Michael C	North Plains, US	7	74
Kim, Sarah E	Portland, US	55	5383
Kobrinsky, Mauro J	Hillsboro, US	133	1696
List, Scott	Beaverton, US	8	425
Marieb, Thomas	Portland, US	13	297
Morrow, Patrick	Portland, US	238	2967
O'Brien, Kevin P	Portland, US	134	665
Ramanathan, Shriram	Hillsboro, US	73	2588

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
July 05, 2011	US,7973407,B2   US7973407B2	GRANTED PATENT AS SECOND PUBLICATION
July 09, 2009	US,20090174070,A1   US20090174070A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 7973407

Three-dimensional stacked substrate arrangements

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