US Patent No: 7,977,580
Number of patents in Portfolio can not be more than 2000
Intermediate multilayer wiring board product, and method for manufacturing multilayer wiring board
Stats
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Jul 12, 2011
Issued date -
May 28, 2009
filing date -
12/473,609
serial no -
In Force
status
Importance
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Abstract
An intermediate multilayer wiring board product includes: a stack of a plurality of resin insulating layers, a first conductor layer, and a second conductor layer. The stack includes: a product forming region comprising a plurality of product portions arranged along a major surface of the stack, each of the plurality of product portions to become a product of the multilayer wiring board; and a frame portion surrounding the product forming region. The first conductor layer is formed on at least one of the plurality of resin insulating layers within each of the plurality of product portions. The second conductor layer is formed on at least one of the plurality of resin insulating layers within the frame portion. The frame portion has a plurality of cuts penetrating the frame portion in a thickness direction thereof, the plurality of cuts being arranged at substantially equal intervals.
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First Claim
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| 2003/0168,249 Wiring board and method for producing the same | 4 | 2003 | |
| 2007/0064,375 Ceramic capacitor | 6 | 2006 | |
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| 7,153,724 Method of fabricating no-lead package for semiconductor die with half-etched leadframe | 2 | 2003 | |
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| 7,015,069 Method of manufacturing a semiconductor device and a semiconductor device | 4 | 2005 | |
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| 6,489,218 Singulation method used in leadless packaging process | 38 | 2001 | |
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| 6,255,697 Integrated circuit devices including distributed and isolated dummy conductive regions | 9 | 1999 | |
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| 6,988,312 Method for producing multilayer circuit board for semiconductor device | 9 | 2002 | |
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| 6,107,179 Integrated flexible interconnection | 11 | 1998 | |
Patent Citation Ranking
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