US Patent No: 7,977,580

Number of patents in Portfolio can not be more than 2000

Intermediate multilayer wiring board product, and method for manufacturing multilayer wiring board

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ALSO PUBLISHED AS: 20090294156
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Abstract

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An intermediate multilayer wiring board product includes: a stack of a plurality of resin insulating layers, a first conductor layer, and a second conductor layer. The stack includes: a product forming region comprising a plurality of product portions arranged along a major surface of the stack, each of the plurality of product portions to become a product of the multilayer wiring board; and a frame portion surrounding the product forming region. The first conductor layer is formed on at least one of the plurality of resin insulating layers within each of the plurality of product portions. The second conductor layer is formed on at least one of the plurality of resin insulating layers within the frame portion. The frame portion has a plurality of cuts penetrating the frame portion in a thickness direction thereof, the plurality of cuts being arranged at substantially equal intervals.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
NGK SPARK PLUG CO., LTD.AICHI1773

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Asano, Toshiya Tochigi, JP 32 161
UENO, Seigo - 3 3

Cited Art Landscape

Patent Info (Count) # Cites Year
 
NGK SPARK PLUG CO., LTD. (2)
2003/0168,249 Wiring board and method for producing the same 4 2003
2007/0064,375 Ceramic capacitor 8 2006
 
NS ELECTRONICS OF BANGKOK (1993) LTD. (1)
7,153,724 Method of fabricating no-lead package for semiconductor die with half-etched leadframe 5 2003
 
RENESAS ELECTRONICS CORPORATION (1)
7,015,069 Method of manufacturing a semiconductor device and a semiconductor device 8 2005
 
RUTGERS, THE STATE UNIVERSITY OF NEW JERSEY (1)
6,489,218 Singulation method used in leadless packaging process 50 2001
 
SAMSUNG ELECTRONICS CO., LTD. (1)
6,255,697 Integrated circuit devices including distributed and isolated dummy conductive regions 12 1999
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (1)
6,988,312 Method for producing multilayer circuit board for semiconductor device 10 2002
 
XEROX CORPORATION (1)
6,107,179 Integrated flexible interconnection 12 1998

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (1)
8,508,050 Wiring substrate, semiconductor device, and method for manufacturing wiring substrate 0 2011

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