Increasing thermal conductivity of host polymer used with laser engraving methods and compositions
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United States of America Patent
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Jul 19, 2011
Grant Date -
Jul 22, 2010
app pub date -
Jan 14, 2010
filing date -
Dec 24, 2001
priority date (Note) -
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Abstract
the invention provides a composition having laser engraving properties, comprising a host material and a laser enhancing additive. The host material comprises a material, such as a polymer, modified by a first process, whereby the host material as modified by the first process has increased thermal conductivity as compared to the host material before the first process. The laser enhancing additive comprises a first quantity of at least one of copper potassium iodide (CuKI.sub.3), Copper Iodide (CuI), potassium iodide (KI), sodium iodide (NaI), and aluminum iodide (AlI), and a second quantity of at least one substance selected from the group consisting of zinc sulfide (ZnS), barium sulfide (BaS), alkyl sulfonate, and thioester.
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