Circuit board with an attached die and intermediate interposer

United States of America Patent

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Jul 19, 2011
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Jan 1, 2009
app pub date
Jun 27, 2007
filing date
Jun 27, 2007

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Abstract

A die having a base formed of a first material is connected to a board having a base formed of a second material. An interposer having a coefficient of thermal expansion intermediate coefficients of thermal expansion of the first and second materials is positioned between the die and the board.

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Patent Owner(s)

Patent Owner	Address
HAMILTON SUNSTRAND CORPORATION	FOUR COLISEUM CENTRE 2730 WEST TYVOLA ROAD CHARLOTTE NC 28217

International Classification(s)

H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

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Inventor Name	Address	# of filed Patents	Total Citations
Cooney, Robert C	Janesville, US	26	92
Wilkinson, Joseph M	Rockford, US	2	6

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Circuit board with an attached die and intermediate interposer

Number of patents in Portfolio can not be more than 2000

United States of America Patent

11768939

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PATENT NO	7982137
APP PUB NO	20090002963A1
SERIAL NO	11768939
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
July 19, 2011	US,7982137,B2 US7982137B2	GRANTED PATENT AS SECOND PUBLICATION
January 01, 2009	US,20090002963,A1 US20090002963A1	FIRST PUBLISHED PATENT APPLICATION

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11768939

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