Stackable semiconductor package having partially exposed semiconductor die and method of fabricating the same
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United States of America Patent
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Jul 19, 2011
Grant Date -
N/A
app pub date -
Mar 6, 2007
filing date -
Mar 6, 2007
priority date (Note) -
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Abstract
A semiconductor package including a package body which is uniquely configured to partially expose the semiconductor die of the package. The partial exposure of the semiconductor die enhances heat dissipation from the die. Additionally, the reduced amount of encapsulant material used in the fabrication of the semiconductor package attributable to only the partial encapsulation of the semiconductor die facilitates a reduction in the overall manufacturing cost related to the semiconductor package, and further allows one or more additional semiconductor packages to be stacked upon the package while still maintaining an overall profile of reduced thickness in the resultant stack.
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