Manufacturing tool for wafer level package and method of placing dies
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United States of America Patent
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Jul 26, 2011
Grant Date -
Nov 10, 2005
app pub date -
Jun 20, 2005
filing date -
May 10, 2004
priority date (Note) -
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Abstract
A manufacturing method of placing dice for a wafer level package comprises placing a plurality of dice on an elastic material, which is formed on a first base, and the elastic material of the present invention has viscosity in a first condition to adhere the plurality of dice; forming an adhesive material on a second base; adhering the plurality of dice on the adhesive material of the second base; and stripping the plurality of dice from the elastic material in a second condition.
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