US Patent No: 7,985,683

Number of patents in Portfolio can not be more than 2000

Method of treating a semiconductor substrate

ALSO PUBLISHED AS: 20100240219

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Abstract

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A method of treating a semiconductor substrate has forming convex patterns over the semiconductor substrate by dry etching, cleaning and modifying a surface of the convex patterns by using chemical, forming a hydrophobic functional surface on the modified surface of the convex patterns, after forming the hydrophobic functional surface, rinsing the semiconductor substrate by using water, drying the semiconductor substrate, and removing the hydrophobic functional group from the hydrophobic functional surface of the convex patterns.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
KABUSHIKI KAISHA TOSHIBATOKYO39845

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iimori, Hiroyasu Yokohama, JP 25 43
Ji, Linan - 17 37
Koide, Tatsuhiko Gifu-ken, JP 31 47
Okuchi, Hisashi Yokohama, JP 66 85
SHIMAYAMA, Kentaro Fukaya-shi, JP 7 16
Tomita, Hiroshi Komaki, JP 380 1964

Cited Art Landscape

Patent Info (Count) # Cites Year
 
RENESAS ELECTRONICS CORPORATION (2)
2008/0020,498 FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 3 2007
7,659,201 Process for manufacturing semiconductor integrated circuit device 4 2008
 
APPLIED MATERIALS, INC. (1)
7,163,018 Single wafer cleaning method to reduce particle defects on a wafer surface 4 2003
 
ASML NETHERLANDS B.V. (1)
2008/0002,162 Lithographic apparatus and device manufacturing method 22 2007
 
E. I. DU PONT DE NEMOURS AND COMPANY (1)
2007/0102,021 Solvent compositions comprising unsaturated fluorinated hydrocarbons 26 2006
 
FREESCALE SEMICONDUCTOR, INC. (1)
2008/0207,005 Wafer Cleaning After Via-Etching 7 2005
 
KABUSHIKI KAISHA TOSHIBA (1)
2009/0255,558 CLEANING APPARATUS FOR SEMICONDUCTOR WAFER AND CLEANING METHOD FOR SEMICONDUCTOR WAFER 4 2009
 
KYOCERA CORPORATION (1)
2005/0205,126 Photovoltaic conversion device, its manufacturing method and solar energy system 2 2005
 
SAMSUNG ELECTRONICS CO., LTD. (1)
6,727,163 Method for sawing wafer 4 2003
 
TOKYO ELECTRON LIMITED (1)
6,620,260 Substrate rinsing and drying method 13 2001
 
Other [Check patent profile for assignment information] (3)
2002/0189,643 Method and apparatus for cleaning/drying hydrophobic wafers 9 2002
6,858,089 Apparatus and method for semiconductor wafer cleaning 11 2003
2006/0278,254 METHOD AND APPARATUS FOR TREATING A SUBSTRATE WITH DENSE FLUID AND PLASMA 21 2006

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