US Patent No: 7,985,683
Number of patents in Portfolio can not be more than 2000
Method of treating a semiconductor substrate
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Jul 26, 2011
Issued date -
May 26, 2010
filing date -
12/801,178
serial no -
In Force
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Abstract
A method of treating a semiconductor substrate has forming convex patterns over the semiconductor substrate by dry etching, cleaning and modifying a surface of the convex patterns by using chemical, forming a hydrophobic functional surface on the modified surface of the convex patterns, after forming the hydrophobic functional surface, rinsing the semiconductor substrate by using water, drying the semiconductor substrate, and removing the hydrophobic functional group from the hydrophobic functional surface of the convex patterns.
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First Claim
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
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| 2008/0020,498 FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | 3 | 2007 | |
| 7,659,201 Process for manufacturing semiconductor integrated circuit device | 4 | 2008 | |
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| 7,163,018 Single wafer cleaning method to reduce particle defects on a wafer surface | 3 | 2003 | |
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| 2008/0002,162 Lithographic apparatus and device manufacturing method | 17 | 2007 | |
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| 2007/0102,021 Solvent compositions comprising unsaturated fluorinated hydrocarbons | 21 | 2006 | |
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| 2008/0207,005 Wafer Cleaning After Via-Etching | 7 | 2005 | |
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| 2009/0255,558 CLEANING APPARATUS FOR SEMICONDUCTOR WAFER AND CLEANING METHOD FOR SEMICONDUCTOR WAFER | 3 | 2009 | |
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| 2005/0205,126 Photovoltaic conversion device, its manufacturing method and solar energy system | 2 | 2005 | |
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| 6,727,163 Method for sawing wafer | 3 | 2003 | |
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| 6,620,260 Substrate rinsing and drying method | 8 | 2001 | |
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| 2002/0189,643 Method and apparatus for cleaning/drying hydrophobic wafers | 9 | 2002 | |
| 6,858,089 Apparatus and method for semiconductor wafer cleaning | 11 | 2003 | |
| 2006/0278,254 METHOD AND APPARATUS FOR TREATING A SUBSTRATE WITH DENSE FLUID AND PLASMA | 16 | 2006 | |
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
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| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Jan 26, 2015 |
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| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jan 26, 2023 |
| Fee | Large entity fee | small entity fee | micro entity fee |
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