Semiconductor light-emitting device and method of fabricating the same

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United States of America Patent

PATENT NO 7985973
APP PUB NO 20100270565A1
SERIAL NO

12834082

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Abstract

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The invention provides a semiconductor light-emitting device package structure. The semiconductor light-emitting device package structure includes a substrate, N sub-mounts, and N semiconductor light-emitting die modules, wherein N is a positive integer lager than or equal to 1. Each of the sub-mounts is embedded on the substrate and exposed partially. Each of the semiconductor light-emitting die modules is mounted on the exposed surface of one of the sub-mounts.

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Patent Owner(s)

Patent OwnerAddress
NEOBULB TECHNOLOGIES INCBRUNEI DARUSSALAM BANDAR SERI BEGAWAN SERI BEGAWAN BRUNEI-MUARA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Jen-Shyan Hsinchu, TW 66 567

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