Light emitting package and light emitting package array formed by coupled electrodes

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United States of America Patent

PATENT NO 7985975
APP PUB NO 20100295082A1
SERIAL NO

12805404

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Abstract

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Example embodiments may include a light emitting device package. The light emitting device package may include a light emitting device, a package body-including a cavity having a bottom surface on which the light emitting device is mounted and a side surface for reflecting light emitted from the light emitting device, a first electrode protruding from the package body, and a second electrode coupled with the package body. The first and second electrodes may be designed to couple respectively with the second and first electrodes of another light emitting device package, thereby forming an array of light emitting device packages.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDSUWON-SI GYEONGGI-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Hyung-kun Yongin-si, KR 29 293
Kim, Yu-sik Yongin-si, KR 68 2179

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