RF rejecting lead
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United States of America Patent
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Jul 26, 2011
Grant Date -
Jan 14, 2010
app pub date -
Sep 14, 2009
filing date -
Nov 30, 2006
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A lead assembly for an implantable medical device. The lead assembly comprises a lead body having a first portion and a second portion. The first portion is adapted for coupling to a pulse generator and the second portion is adapted for implantation in or near a heart. First and second co-radial conductive coils are positioned within the lead body and electrically isolated from each other. The first and second conductive coils include a first and second number of coil turns and the first number is substantially equivalent to the second number. A ring electrode is located at the second portion and a tip electrode is located distal to the ring electrode and coupled to the second conductive coil.
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