Apparatuses and methods for maskless mesoscale material deposition

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United States of America Patent

PATENT NO 7987813
APP PUB NO 20090114151A1
SERIAL NO

12349279

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100° C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance—the orifice to substrate distance may be several millimeters—and direct write onto non-planar surfaces is possible.

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Patent Owner(s)

  • OPTOMEC, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Essien, Marcelino Cedar Crest, US 22 1422
Giridharan, Manampathy G Mason, US 34 695
King, Bruce H Albuquerque, US 22 1757
Marquez, Gregory J Albuquerque, US 7 598
Renn, Michael J Hudson, US 34 2272
Sheu, Jyh-Cherng Hsinchu, TW 46 1250

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