Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features
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United States of America Patent
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Aug 2, 2011
Grant Date -
Oct 7, 2010
app pub date -
Jun 11, 2010
filing date -
Nov 26, 1997
priority date (Note) -
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Abstract
We disclose a method of depositing a metal seed layer on a wafer substrate comprising a plurality of recessed device features. The method comprises depositing a first portion of a copper seed layer on a wafer substrate without excessive build-up on the openings of each of the plurality of recessed device features, while obtaining bottom coverage without substantial sputtering of the bottom surface. The method also comprises depositing a second portion of the metal seed layer while redistributing at least a portion of the bottom coverage material to the sidewalls of each recessed device feature, to provide a uniform seed layer coverage over the interior surface of the recessed device features.
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