Integrated circuit packaging system having a cavity
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United States of America Patent
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Aug 2, 2011
Issued Date -
N/A
app pub date -
Aug 14, 2008
filing date -
Aug 14, 2008
priority date (Note) -
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Abstract
An integrated circuit packaging system includes: attaching a carrier, having a carrier top side and a carrier bottom side, and an interconnect without an active device attached to the carrier bottom side; and forming a first encapsulation, having a cavity, around the interconnect over the carrier top side with the interconnect partially exposed from the first encapsulation and with the carrier top side partially exposed with the cavity.
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