Electronic device with heat dissipating structure
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 2, 2011
Grant Date -
May 12, 2011
app pub date -
Dec 8, 2009
filing date -
Nov 6, 2009
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic device includes a first and a second air passages. A first and a second electronic components locate in the first and second air passages, respectively. A first heat sink includes a first heat dissipation portion contacting the first electronic component and located in the first air passage and a second heat dissipation portion located in the second air passage. A second heat sink includes a first heat dissipation portion contacting the second electronic component and located in the second air passage and a second heat dissipation portion located in the first air passage. The first heat dissipation portion of the first heat sink aligns with the second heat dissipation portion of the second heat sink and the second heat dissipation portion of the first heat sink aligns with the first heat dissipation portion of the second heat sink along a flowing direction of the t air passage.
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