Method of manufacturing a patterned conductive layer
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United States of America Patent
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Aug 9, 2011
Grant Date -
Dec 3, 2009
app pub date -
Aug 10, 2009
filing date -
Apr 4, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
According to embodiments of the present invention, a method for manufacturing a pattern of conductive elements on a substrate is provided. The method includes applying a coating layer of electrically conductive transparent compounds onto a substrate; depositing in a vacuum deposition chamber an electrically conductive material onto the coating layer to form an electrically conductive layer; applying an etch-resist material on selective areas of the electrically conductive layer, wherein the selective areas are substantially areas pre-designed to carry the conductive objects; and chemically etching the electrically conductive material from exposed areas of the electrically conductive layer that are not covered by the etch-resist material.
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