Deposition sub-chamber with variable flow
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United States of America Patent
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Aug 9, 2011
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app pub date -
Jan 23, 2007
filing date -
Jan 23, 2007
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Abstract
An apparatus and method for depositing film on a substrate includes a plurality of conduits that allow by-product and reactant gases to flow past the edge of a substrate. The apparatus and process of the present invention has several advantages for enhanced chamber performance, particularly for micro-volume chambers using pulsed deposition layer processes.
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