Method of forming molded standoff structures on integrated circuit devices
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United States of America Patent
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Aug 9, 2011
Grant Date -
Jan 8, 2009
app pub date -
Jul 2, 2007
filing date -
Jul 2, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A method of forming molding standoff structures on integrated circuit devices is disclosed which includes forming a plurality of standoff structures on a substantially rectangular sheet of transparent material and, after forming the standoff structures, singulating the substantially rectangular sheet of transparent material into a plurality of individual transparent members, each of which comprise at least one of the plurality of standoff structures.
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