Method of making a semiconductor chip assembly with chip and encapsulant grinding
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United States of America Patent
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Aug 9, 2011
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N/A
app pub date -
Oct 26, 2006
filing date -
Nov 17, 2003
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Abstract
A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip to a routing line, then forming an encapsulant that covers the chip, then grinding the encapsulant without grinding the chip and then grinding the encapsulant and the chip such that the encapsulant and the chip are laterally aligned.
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