Sensor module and method for manufacturing same
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United States of America Patent
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Aug 9, 2011
Grant Date -
Jun 7, 2007
app pub date -
Nov 14, 2006
filing date -
Nov 14, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
A sensor module has a carrier substrate having a bottom side and a top side, a sensor chip arranged on the top side of the carrier substrate and having a pressure-sensitive active area, a signal-processing chip arranged on the top side of the carrier substrate next to the sensor chip and being connected to the sensor chip in an electrically conducting manner, a continuous casting material covering the top side of the carrier substrate and the signal-processing chip and being in mechanical contact with both, the casting material having a recess which is arranged such that the casting material does not cover at least a part of the active area of the sensor chip.
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