Heat sink for integrated circuit devices
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United States of America Patent
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-
Aug 9, 2011
Grant Date -
Jan 24, 2008
app pub date -
Jul 13, 2007
filing date -
Jan 10, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A resistor with heat sink is provided. The heat sink includes a conductive path having metal or other thermal conductor having a high thermal conductivity. To avoid shorting the electrical resistor to ground with the thermal conductor, a thin layer of high thermal conductivity electrical insulator is interposed between the thermal conductor and the body of the resistor. Accordingly, a resistor can carry large amounts of current because the high conductivity thermal conductor will conduct heat away from the resistor to a heat sink. Various configurations of thermal conductors and heat sinks are provided offering good thermal conductive properties in addition to reduced parasitic capacitances and other parasitic electrical effects, which would reduce the high frequency response of the electrical resistor.
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