Electrically conductive protection layer and a microelectromechanical device using the same
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United States of America Patent
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Aug 16, 2011
Grant Date -
Sep 17, 2009
app pub date -
Mar 12, 2008
filing date -
Mar 12, 2008
priority date (Note) -
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Abstract
A deformable hinge for use in microelectromechanical devices comprises a protection layer that is electrically conductive. The protection layer is on top of another hinge layer; and is more resistive than the hinge layer to the etchant used in during patterning and/or release processes during fabrication of the microelectromechanical device. As a result, the hinge layer can be protected from being damaged during the fabrication process.
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