Polishing composition and polishing method
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United States of America Patent
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Aug 16, 2011
Grant Date -
Aug 9, 2007
app pub date -
Feb 2, 2007
filing date -
Feb 7, 2006
priority date (Note) -
Expired
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Abstract
The polishing composition contains polyoxyethylene sorbitan mono-fatty acid ester, silicon dioxide, water soluble cellulose, an alkaline compound, and water. The content of polyoxyethylene sorbitan mono-fatty acid ester in the polishing composition is less than 0.0025% by mass. The polishing composition is appropriate for final polishing of silicon wafers.
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