Arrangement having at least one electronic component
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Aug 16, 2011
Grant Date -
Oct 9, 2008
app pub date -
Jun 10, 2008
filing date -
Dec 13, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
The invention relates to an arrangement comprising at least one electronic component and a cooling body associated therewith. A support physically interposed between the electronic component and the cooling body and the support has at least one layer with at least one material of an electric strength of at least 10 kV/mm and a thermal conductivity of at least 5 W/mK. At least one recess and/or at least one protruding element is arranged in and/or on the layer of the support, and is configured in such a manner that it extends, along the surface of the layer of the support, through preferably all electrically possible pathways between the electronic component and the cooling body as compared to the condition of the layer of the support without the recess and/or without the protruding element.
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